Lenovo Group Ltd.'s CFO, Winston Cheng, is actively managing the company's capital during what he describes as the "greatest infrastructure build in the history of mankind" due to the AI boom. Lenovo recently raised $2 billion through the sale of seven-year zero-coupon convertible bonds due in 2033, marking a significant capital inflow two years after a similar raise from Saudi Arabia’s sovereign wealth fund. The bonds were sold at a conversion premium of 47.5% to Wednesday’s closing share price, within the marketed range of 40% to 50%.
The net proceeds from this bond issue are estimated to be approximately $1,979 million. Lenovo plans to allocate these funds strategically: about $1.2 billion, or 60.64% of the net proceeds, will be used to refinance existing indebtedness of the Group, including funding a concurrent repurchase of approximately $662 million of existing 2029 convertible bonds. This portion is expected to be fully utilized by January 27, 2028.
The remaining approximately $779 million, or 39.36% of the net proceeds, is earmarked for future share buy-backs to achieve a dilution-neutral outcome following the bond issuance, and for general corporate purposes. These corporate purposes include payments to suppliers and manufacturers, and other operational expenses. This allocation is expected to be fully utilized by June 25, 2032.
Lenovo also completed a concurrent repurchase of approximately $225 million in aggregate principal amount of its existing 2029 convertible bonds, which will be cancelled. The company may continue to purchase the remaining $450 million of outstanding 2029 convertible bonds. The company intends to conduct open-market share buy-backs to ensure a dilution-neutral effect for existing shareholders.
Lenovo's shares have shown strong performance, doubling in May for their best monthly advance since 1999, with a 22% jump on one Friday alone, driven by investor enthusiasm for its AI-powered growth. This strong performance, influenced by robust AI-related earnings, has helped offset challenges posed by rising component prices.